Additional information
| Product Format | Thermal Compound / Cooling Paste |
|---|---|
| Quantity in Package | 1x 1g |
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1g grey thermal heatsink compound made from silicone fluid with 20% metal oxide, supplied in a syringe for controlled application to compatible PC processors, CPUs and heatsinks. Specified with 1.829 W/m·K thermal conductivity, 0.123 °C·in²/W thermal resistance and 5.0kV AC dielectric breakdown.
In stock
| Product Format | Thermal Compound / Cooling Paste |
|---|---|
| Quantity in Package | 1x 1g |